MWC 2019 is around the corner and just before the event, Xiaomi released its flagship Xiaomi Mi 9 photos on Twitter. Mr Xiang Wang the Senior Vice President of the company has revealed the back side of the phone on Twitter with some eye-catching images. Mr Xiang also tweeted that Xiaomi is using Nano-level laser engraving holographic technology + dual layer Nano coating to create this beautiful and unique colour. The images reveal gradient finish at the back of the device which looks stunning. In the photos, the 3D glass back gives a multi-colour holographic effect which is amazing to watch and gives a premium feel to the phone.
On the back of the phone, we also see a 3 lens camera setup from which we can assume that Xiaomi has added up a wide angle lens to the phone. On the top camera lens we can see a multi-coloured ring, we have to see what is the significance of it in the MWC 19 event in Barcelona. Also, the rim on the sides of the triple camera setup is the same coloured like the back of the phone.
Xiaomi Mi 9 has no physical Finger Print sensor on the back, thus the device will come with an in display fingerprint sensor which is now a market trend. On the bottom of the device, we can see the speaker grill and a USB type C port. Like every other device in 2019, we do not see any headphone jack.
In one more tweet, Xiang Wang revealed there partnership with Qualcomm and will be launching Xiaomi Mi 9 with Qualcomm’s Snapdragon 855 processor, making it the very first phone with Snapdragon 855 processor in 2019.
We have a keen eye on Xiaomi and will soon update the first glance and specifications when its officially released at MWC.